16th International IEEE MID Congress – Mechtronic Integration Discourse

This international IEEE-affiliated congress brings together
researchers, engineers, and industry leaders to explore cutting-edge advancements in
Mechatronic Integrated Devices (MID) and 3D electronic integration.

- Congress Highlights -

IEEE-recognized: All accepted scientific contributions will be submitted for inclusion in IEEE Xplore
Keynotes by leading voices from Nano Dimension, IPC, and Siemens AG
12 technical sessions on topics such as radar systems, additive mechatronics, sensor integration, AI, and thermal management
Poster exhibitions, networking sessions, and the MID Best Paper & Best PhD Awards
Exclusive technical tour of the Siemens Electronics Plant in Amberg
Dedicated IPC workshop on 3D electronics standardization

This congress directly addresses the megatrends of our time – digitalization, automation, miniaturization, and sustainability – and shows how MID technologies are reshaping everything from smart infrastructure to medical systems.

Be part of this unique IEEE event and connect with international thought leaders shaping the future of mechatronics and integrated electronics.

We look forward to welcoming you in Amberg!

Warm regards,

Prof. Dr. Florian Risch & Prof. Dr. Jörg Franke

https://www.3d-mid.de/wp-content/uploads/pr_250503_preliminary_programm.pdf
https://www.3d-mid.de/kongress/teilnehmer/teilnehmer_anmeldung.php